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Robert C. Mcconkey

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Anionic imino-containing polymeric adhesives for...

C - Chemistry – Metallurgy – 08 – G
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Laminate for the formation of beam leads for ic chip bonding

G - Physics – 03 – F
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Light-sensitive polymers

C - Chemistry – Metallurgy – 08 – F
Patent

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Photopolymerizable compositions and elements and uses thereof

G - Physics – 03 – F
Patent

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Photoresist composition comprising cyclohexyleneoxyalkyl...

G - Physics – 03 – F
Patent

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Laminate for the formation of beam leads for ic chip bonding

G - Physics – 03 – F
Patent

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Profile ID: LFCA-PAI-P-188343

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