Arrangement for coupling films to leader

G - Physics – 03 – D

Patent

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G03D 13/08 (2006.01) G03D 3/13 (2006.01) G03D 13/00 (2006.01)

Patent

CA 2120474

Various arrangements are proposed for coupling films to a leader. A hole is formed in one of the films and the leader to receive a tab which is formed on the other. These arrangements allow stable coupling of the films to the leader and easy uncoupling. They eliminate the use of splice tape.

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