Arrangement having at least one electronic component

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01) H01L 23/36 (2006.01) H01L 23/373 (2006.01) H05K 1/05 (2006.01)

Patent

CA 2633906

The invention relates to an arrangement comprising at least one electronic component (1) and a cooling body (3) associated therewith and a support physically interposed between the electronic component (1) and the cooling body (3) and having at least one layer (2) with at least one material of an electric strength of at least 10 kV/mm and a thermal conductivity of at least 5 W/mK. At least one recess (5) and/or at least one protruding element is arranged in and/or on the layer (2) of the support and is configured in such a manner that it extends, along the surface of the layer (2) of the support, preferably all electrically possible pathways between the electronic component (1) and the cooling body as compared to the condition of the layer (2) of the support without the recess (5) and/or without the protruding element.

Ensemble comportant au moins un composant électronique (1) et un dissipateur thermique (3) associé au composant, ainsi qu'un corps de support placé dans l'espace entre le composant électronique (1) et le dissipateur thermique (3). Ledit corps de support possède au moins une couche (2) qui comporte au moins une matière ayant une rigidité diélectrique d'au moins 10 kV/mm et une conductivité thermique spécifique d'au moins 5 W/mK. Au moins un évidement (5) et / ou au moins un élément en saillie sont placés dans la couche susmentionnée (2) du corps de support et / ou sur cette couche, et ils sont conçus de manière telle qu'ils prolongent, sur la surface de la couche (2) du corps de support, de préférence tous les cheminements électriques possibles entre le composant électronique (1) et le dissipateur thermique, par rapport à une couche (2) du corps de support ne présentant pas d'évidement (5) et / ou pas d'élément en saillie.

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