Ball grid attachment

Details Ball grid attachment Ball grid attachment

H - Electricity

01

L

H01L 21/00 (2006.01) H01R 4/04 (2006.01)

Patent

CA 2631142

A device and method employing an electrically conductive adhesive for electrically and mechanically connecting an electrical component to a board substrate. The electrical component can include an integrated circuit and the board may include a printed circuit board. The possible adhesives include a silver conducting RTV, silver- conducting adhesive, as well as silver conducting epoxy.

L'invention concerne un dispositif et un procédé dans lesquels est utilisé un adhésif électroconducteur pour fixer et connecter un composant électrique sur un substrat. Le composant électrique peut être un circuit intégré et le substrat peut être une carte de circuit imprimé. Les adhésifs pouvant être utilisés comprennent un RTV conducteur à base d'argent, un adhésif conducteur à base d'argent, ainsi qu'un époxyde conducteur à base d'argent.

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