B - Operations – Transporting – 32 – B
Patent
B - Operations, Transporting
32
B
B32B 15/01 (2006.01) B23K 35/00 (2006.01) B32B 7/02 (2006.01) H01L 21/60 (2006.01) H01L 21/603 (2006.01) H01S 5/02 (2006.01) B32B 31/20 (1990.01)
Patent
CA 2080931
- 10 - BONDING METHOD USING SOLDER COMPOSED OF MULTIPLE ALTERNATING GOLD AND TIN LAYERS Abstract A device such as a laser is bonded to a submount such as diamond by a process in which the submount is successively coated with an adhesion layer such as titanium, a barrier layer such as nickel, and a gold-tin solder-metallization composite layer formed by sequential deposition on the barrier layer a number (preferably greater than seven) of multiple alternating layers of gold and tin, the last layer being gold having a thickness that is equal to approximately one-half or less than thethickness of the (next-to-last) tin layer that it contacts immediately beneath it. The bonding is performed under applied heat that is sufficient to melt the solder- metallization composite layer. Prior to the bonding, (in addition to the submount) the device advantageously is coated with gold and optionally with a similar gold-tin solder-metallization composite layer, at least at locations where it comes in contact with the gold-tin solder-metallization composite layer.
Katz Avishay
Lee Chien-Hsun
Tai King Lien
Wong Yiu-Man
American Telephone And Telegraph Company
Kirby Eades Gale Baker
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