4. G - Physics
  5. 03
  6. F

King Lien Tai

G - Physics – 03 – F

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Country: United States Of America

Bonding method using solder composed of multiple alternating...

B - Operations – Transporting – 32 – B
Patent

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Curbside circuitry for interactive communication services

H - Electricity – 04 – N
Patent

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Integrated circuit package and compact assemblies thereof

H - Electricity – 01 – L
Patent

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Method of producing devices using nonplanar lithography

G - Physics – 03 – F
Patent

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Packaging micromechanical devices

B - Operations – Transporting – 81 – C
Patent

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Planar filter with additional coupling created by bent...

H - Electricity – 01 – P
Patent

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Profile ID: LFCA-PAI-P-1093826

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