H - Electricity
01
L
356/193, 117/234
H01L 21/447 (2006.01) C04B 41/50 (2006.01) C04B 41/85 (2006.01) C23C 16/26 (2006.01) H01L 21/603 (2006.01)
Patent
CA 2023933
TITLE OF THE INVENTION A bonding tool ABSTRACT OF THE DISCLOSURE A bonding tool for TAB, used in the production of semiconductor chips, which is provided with, at the end there- of, a substrate consisting of a member selected from the group consisting of sintered compacts of Si or Si3N4 as a predomi- nant component, sintered compacts of SiC as a predominant com- ponent, sintered compacts of AlN as a predominant component and composite compacts thereof, the substrate being coated with polycrystalline diamond deposited by gaseous phase syn- thesis method.
Fujimori Naoji
Ikegaya Akihiko
Imai Takahiro
Nakai Tetsuo
Nakamura Tsutomu
Riches Mckenzie & Herbert Llp
Sumitomo Electric Industries Ltd.
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