Cap layers and/or passivation layers for nitride-based...

H - Electricity – 01 – L

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H01L 29/778 (2006.01) H01L 21/318 (2006.01) H01L 21/335 (2006.01)

Patent

CA 2588114

High electron mobility transistors are provided that include a non-uniform aluminum concentration AlGaN based cap layer having a high aluminum concentration adjacent a surface of the cap layer that is remote from the barrier layer on which the cap layer is provided. High electron mobility transistors are provided that include a cap layer having a doped region adjacent a surface of the cap layer that is remote from the barrier layer on which the cap layer is provided. Graphitic BN passivation structures for wide bandgap semiconductor devices are provided. SiC passivation structures for Group III-nitride semiconductor devices are provided. Oxygen anneals of passivation structures are also provided. Ohmic contacts without a recess are also provided.

La présente invention concerne des transistors à mobilité électronique élevée qui comprennent une couche d'encapsulation à base d'AlGaN à concentration en aluminium non uniforme, ayant une concentration en aluminium élevée au voisinage d'une surface de la couche d'encapsulation, qui se trouve à distance de la couche barrière sur laquelle se trouve la couche d'encapsulation. L'invention a également pour objet des transistors à mobilité électronique élevée qui comprennent une couche d'encapsulation présentant une zone dopée adjacente à une surface de la couche d'encapsulation, qui se trouve à distance de la couche barrière sur laquelle se trouve la couche d'encapsulation. L'invention se rapporte également à des structures de passivation BN graphitiques destinées à des dispositifs à semi-conducteur à large bande, des structures de passivation SiC destinées aux dispositifs à semi-conducteur à nitrure du groupe III, des recuits à l'oxygène de structures de passivation, et des contacts ohmiques dépourvus de partie en retrait.

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