Carbon-phenol resin molding compound

Details Carbon-phenol resin molding compound Carbon-phenol resin molding compound

H - Electricity

01

B

H01B 1/24 (2006.01) C08K 3/04 (2006.01)

Patent

CA 2397006

A carbon-phenol resin molding compound is provided, which is preferably used to obtain molded articles having high electrical and thermal conductivities as well as good mechanical strength. The resin molding compound is prepared by reacting a phenol with an aldehyde in the presence of a catalyst, while mixing them with a carbon powder such that a content of the carbon powder in the molding compound is 75 wt% or more. The catalyst is at least one selected from tertiary amines, carbonates, hydroxides and oxides of alkali metals or alkali earth metals.

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