Chip package capacitor cover

Details Chip package capacitor cover Chip package capacitor cover

H - Electricity

01

L

356/143

H01L 23/02 (2006.01) H01L 23/04 (2006.01) H01L 23/057 (2006.01) H01L 23/64 (2006.01)

Patent

CA 2014255

A cover 10 for a semiconductor chip package 50. Cover 10 comprises a sealing surface for providing a seal between cover 10 and a semiconductor chip package 50. A mounting surface 12 for mounting a capacitor 14 to the surface of cover 10 is provided. The mounting surface 12 comprises metalization including a metalized power pad 20 and a metalized ground pad 22 for mounting at least one capacitor 14 on surface 12 of the cover.

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