H - Electricity – 01 – L
Inventor
H - Electricity
01
L
Inventor
Country: United States Of America
Chip package capacitor cover
High density bond pad design
Package to board variable pitch tab
Stacked leadframe assembly
Universal semiconductor chip package
High density bond pad design
Stacked leadframe assembly
Universal semiconductor chip package
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Profile ID: LFCA-PAI-P-1100780