Stacked leadframe assembly

Details Stacked leadframe assembly Stacked leadframe assembly

H - Electricity

01

L

356/146

H01L 23/495 (2006.01) H01L 21/48 (2006.01)

Patent

CA 1315021

STACKED LEADFRAME ASSEMBLY Abstract of the Disclosure Disclosed is a stacked leadframe assembly for use with integrated circuit chips. The assembly comprises multiple leadframes arranged in stacked relation. Each leadframe comprises conductive elements and solder bumps for electrically and mechanically connecting selected conductive elements of the leadframes.

613013

Affiliated with

Also associated with

Rating

Stacked leadframe assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked leadframe assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked leadframe assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1186967