Package to board variable pitch tab

Details Package to board variable pitch tab Package to board variable pitch tab

H - Electricity

01

L

356/146

H01L 23/495 (2006.01) H01L 21/60 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2014871

A variable pitch tab leadframe assembly comprising a plurality of patterned conductive elements for transmitting input and output signals to bonding locations on an electronic device. The leadframe assembly comprises conductive elements with a variable pitch to accommodate a plurality of standard pitch bond site printed circuit board footprints.

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