High density bond pad design

Details High density bond pad design High density bond pad design

H - Electricity

01

L

356/143

H01L 23/02 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2009723

A semiconductor chip package having a top surface with a recessed chip carrying cavity, and a double row of staggered single tier bonding pads placed around the cavity.

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