Cleaning wafer substrates of metal contamination while...

Details Cleaning wafer substrates of metal contamination while... Cleaning wafer substrates of metal contamination while...

C - Chemistry, Metallurgy

23

G

C23G 1/14 (2006.01) C11D 1/88 (2006.01) C11D 1/90 (2006.01) C11D 1/92 (2006.01) C11D 3/26 (2006.01) C11D 3/43 (2006.01) H01L 21/306 (2006.01) H01L 21/70 (2006.01)

Patent

CA 2146680

Process for cleaning wafer substrates of metal contamination while maintaining wafer smoothness by contacting the wafer substrates with a cleaning composition comprising an aqueous, metal ion-free base and an amphoteric surfactant and optionally a metal complexing agent and a propylene glycol ether organic solvent.

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