C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
117/196
C09D 179/08 (2006.01) C08G 73/10 (2006.01) G03F 7/038 (2006.01) H01B 3/30 (2006.01) H01B 7/29 (2006.01) H01B 7/295 (2006.01) H01L 21/312 (2006.01) H05K 1/03 (2006.01)
Patent
CA 2009085
ABSTRACT OF THE INVENTION The present invention provides a process for coating substrates with a polyimide polymer, said polymer prepared by a process of subjecting a mixture of aromatic dianhydride and aromatic diamine monomers, at least one of which contains the group (CF3 - ? - R) linking two aromatic moieties, wherein R is CF3 or phenyl, to a low temperature, substantially isothermal solution polymerization process wherein the content of the mixed monomers in solvent is maintained within the range of from about 8 to about 12% by weight solids concentration during the polymerization process. The process is conducted for a sufficient length of time and uniformity of temperature, generally below about 35°C, to achieve a weight average polyimide polymer molecular weight within the range of about 80,000 to about 135,000, more preferably of about 90,000 to about 125,000, a polyimide inherent viscosity within the range of from about 0.45 to about 0.70, and a polydispersity with the range of from about 1.7 to about 2.6. The invention also relates to articles coated with said polyimide polymer, such as silicon wafers.
Khanna Dinesh N.
Vora Rohitkumar H.
Hoechst Celanese Corporation
Khanna Dinesh N.
Smart & Biggar
Vora Rohitkumar H.
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