H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/12 (2006.01)
Patent
CA 2552908
A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c) which are tapered as having an opening size progressively decreasing from a main surface (21) and an external connection surface (22) toward a minimum size hole portion (11a). The taper surfaces (11b, 11c) respectively form obtuse angles .theta.1, .theta.2 with the main surface (21) and the external connection surface (22). A semiconductor element mount (BL) includes an insulative member (2) cut out of the collective substrate (1). An imaging device (PE2) includes an imaging element (PE1) mounted in a region surrounded by a frame (4) which is bonded to the main surface (21) of the insulative member (2) and closed by a cover (FL). A light emitting diode component (LE2) includes a light emitting element (LE1) mounted on the main surface (21) of the insulative member (2) with the minimum size hole portion (11a) of the through-hole being filled with an electrically conductive material (33a), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE3) includes the light emitting diode component (LE2) mounted in a package (7).
L'invention porte sur un substrat collectif (1) produit par formation d'un trou traversant (11) après frittage d'une feuille verte céramique, où la surface interne du trou traversant (11) présente des surfaces taraudées (11b, 11c) de sorte que les dimensions d'ouverture diminuent progressivement depuis le côté surface principale (21) et le côté surface de connexion externe (22) vers la petite partie trouée (11a) et les angles ?1 et ?2 formés entre les faces taraudées (11b, 11c) et la surface principale (21) et la surface de connexion externe (22) décrivent tous deux des angles obtus. Un support de montage d'élément semi-conducteur BL comprend un support isolant (2) découpé du substrat collectif (1). Un dispositif d'imagerie PE2 supporte un élément semi-conducteur PE1 dans une région entourée par un cadre (4) collée au côté surface principale (21) du support isolant (2) et refermée par un couvercle FL. Un support constituant une diode luminescente LE2 supporte un élément luminescent LE1 à la surface principale (21) du support isolant (2) où la petite partie trouée (11a) est remplie d'un matériau conducteur (33a) et est scellée par du phosphore et/ou une résine de protection FR. Une diode luminescente LE3 maintient le support constituant une diode luminescente LE2 dans un paquet (7).
Higaki Kenjiro
Ishidu Sadamu
Takagi Daisuke
Tsuzuki Yasushi
A. L. M. T. Corp.
Riches Mckenzie & Herbert Llp
LandOfFree
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