4. H - Electricity
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Kenjiro Higaki

H - Electricity – 01 – L

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Country: Japan

Aluminum nitride sintered body and manufacturing method thereof

C - Chemistry – Metallurgy – 04 – B
Patent

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Collective substrate, semiconductor element mount,...

H - Electricity – 01 – L
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Compound oxide superconducting thin film with buffer layer

H - Electricity – 01 – L
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Diamond wafer, method of estimating a diamond wafer and...

C - Chemistry – Metallurgy – 30 – B
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Diamond wafer, method of estimating a diamond wafer and...

G - Physics – 01 – N
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Profile ID: LFCA-PAI-P-1095084

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