Diamond wafer, method of estimating a diamond wafer and...

Details Diamond wafer, method of estimating a diamond wafer and... Diamond wafer, method of estimating a diamond wafer and...

C - Chemistry, Metallurgy

30

B

C30B 29/04 (2006.01) G01N 21/88 (2006.01) G10K 11/36 (2006.01) H03H 9/02 (2006.01)

Patent

CA 2249276

Surfaces of diamond crystals are examined by coating the surfaces with thin metal films, launching laser beams to the diamond surfaces in a slanting angle, detecting defects and particles on the diamond surfaces by the scattering of beams and counting the defects and particles by a laser scanning surface defect detection apparatus. Diamond SAW devices should be made on the diamond films or bulks with the defect density less than 300 particles cm-2. Preferably, the diamond surfaces should have roughness less than Ra20nm. Diamond SAW filters can be produced by depositing a piezoelectric film and making interdigital transducers on the low-defect density diamond crystals.

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