Diamond wafer, method of estimating a diamond wafer and...

C - Chemistry – Metallurgy – 30 – B

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C30B 29/04 (2006.01) G01N 21/88 (2006.01) G10K 11/36 (2006.01) H03H 9/02 (2006.01)

Patent

CA 2249276

Surfaces of diamond crystals are examined by coating the surfaces with thin metal films, launching laser beams to the diamond surfaces in a slanting angle, detecting defects and particles on the diamond surfaces by the scattering of beams and counting the defects and particles by a laser scanning surface defect detection apparatus. Diamond SAW devices should be made on the diamond films or bulks with the defect density less than 300 particles cm-2. Preferably, the diamond surfaces should have roughness less than Ra20nm. Diamond SAW filters can be produced by depositing a piezoelectric film and making interdigital transducers on the low-defect density diamond crystals.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Diamond wafer, method of estimating a diamond wafer and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diamond wafer, method of estimating a diamond wafer and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diamond wafer, method of estimating a diamond wafer and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1689898

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.