Composition and method for sealing electronic parts

Details Composition and method for sealing electronic parts Composition and method for sealing electronic parts

C - Chemistry, Metallurgy

08

G

400/3026, 18/60

C08G 75/02 (2006.01) H01B 3/30 (2006.01) H01L 21/56 (2006.01) H05K 1/03 (2006.01) H05K 1/05 (2006.01)

Patent

CA 1304182

20375-527F ABSTRACT OF THE DISCLOSURE Disclosed is a composition for sealing electronic parts comprising a synthetic resin component and an inorganic filler in an amount of 20 to 300 parts by weight per 100 parts of the synthetic resin component. The synthetic resin component mainly comprises a phenylene sulfide block copolymer consisting essentially of a recurring unit (A) Image and a recurring unit (B) Image . The sealing composition do not form cracks and water penetration may be prevented.

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