Compositions based on resins having silicon atoms attached...

C - Chemistry – Metallurgy – 08 – G

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C08G 85/00 (2006.01) C08G 18/46 (2006.01) C08G 18/62 (2006.01) C08G 18/83 (2006.01) C08L 75/04 (2006.01) C08L 101/10 (2006.01) C09D 143/04 (2006.01) C09D 201/10 (2006.01)

Patent

CA 1274933

Abstract Of The Disclosure Disclosed is a resin containing at least one molecule having in a terminal and/or side chain thereof at least one group corresponding to the following formula (I) Image (I) wherein Q is the residue of a substance selected from the group consisting of a polyester resin, an acrylic resin, a urethane resin, a polyamide resin, and a polyether resin, each Y, which may be the same or different, represents a hydrolyzable group, each R, which may be the same or different, represents a C1-C4 alkyl group, a vinyl group or an allyl group, each R', which may be the same or different, represents H or a C1-C4 alkyl group, a represents an integer of from 0 to 2, b represents an integer of from 0 to 6, and n represents an integer of from 1 to 2. Also disclosed is a curable composltion based on a resin corresponding to formula (I) and the composition additionally containing an organic polyol and/or a reactive silicon-containing constituent different from the resin of formula (I) which silicon-containing constituent contains a hydrolyzable group bonded to silicon. Also disclosed is a curable composition containing (A) a first silicon-containing resin containing at least one molecule having in a terminal and/or side chain thereof at least one silicon atom bonded to a group Y, wherein Y represents a hydrolyzable group; and (B) a second silicon-containing resin, different from the first silicon-containing resin, the second silicon-containing resin being a resin of the invention. In preferred compositions, the second silicon-containing resin serves as a flexibilizer for the composition.

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