G - Physics – 03 – F
Patent
G - Physics
03
F
G03F 7/42 (2006.01) H01L 21/3213 (2006.01)
Patent
CA 2606849
The invention provides cleaning compositions for cleaning microelectronic substrates that are able to essentially completely clean such substrates and inhibit metal corrosion or produce essentially no corrosion of the metal elements of such substrates, and to do so at relatively short cleaning times and relatively low temperatures compared to the cleaning times required for prior art alkaline-containing cleaning compositions. The invention also provides method of using such cleaning compositions to clean microelectronic substrates without producing any significant corrosion of the metal elements of the microelectronic substrate. The cleaning compositions of this invention comprise (a) at least one organic solvent, (b) at least one unneutralized inorganic phosphorus-containing acid, and (c) water. The cleaning compositions of this invention optionally can have present in the compositions other components, such as for example surfactants, metal complexing or chelating agents, corrosion inhibitors, and the like. The cleaning compositions of this invention are characterized by an absence of organic amines, hydroxylamines or other strong bases such as ammonium bases and the like that would neutralize the inorganic phosphorus-containing acid component. The cleaning and residue removal compositions of this invention are especially suitable for cleaning microelectronic substrates containing aluminum, titanium, and tungsten.
L'invention concerne des compositions de nettoyage pour nettoyer des substrats microélectronique, pouvant essentiellement nettoyer complètement de tels substrats et inhiber la corrosion métallique ou ne produire essentiellement aucune corrosion d'éléments métalliques de tels substrats, et ce, pendant des durées de nettoyage relativement courtes et à des températures relativement faibles en comparaison aux durées de nettoyage requises pour des compositions de nettoyage alcalines de l'état de la technique. L'invention concerne également une méthode d'utilisation de telles compositions de nettoyage pour nettoyer des substrats microélectroniques sans produire de corrosion importante des éléments métalliques du substrat microélectronique. Les compositions de nettoyage de l'invention comprennent: (a) au moins un solvant organique, (b) au moins un acide contenant du phosphore inorganique non neutralisé, et (c) de l'eau. Les compositions de nettoyage de l'invention peuvent éventuellement présenter d'autres composants, notamment, par exemple, des surnageants, des agents de complexation ou des agents de chélation métalliques, des inhibiteurs de corrosion et analogues. Les compositions de nettoyage de cette invention sont caractérisées par une absence d'amines organiques, d'hydroxylamines ou d'autres bases fortes, notamment des bases d'ammonium et analogues qui neutraliseraient le composant acide contenant du phosphore inorganique. Les compositions de nettoyage et de suppression de résidus de l'invention sont particulièrement appropriées au nettoyage de substrats microélectroniques contenant de l'aluminium, du titane et du tungstène.
Avantor Performance Materials Inc.
Mallinckrodt Baker Inc.
Osler Hoskin & Harcourt Llp
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