C - Chemistry – Metallurgy – 03 – C
Patent
C - Chemistry, Metallurgy
03
C
C03C 27/02 (2006.01) C03C 29/00 (2006.01) H01L 23/10 (2006.01)
Patent
CA 2098699
ABSTRACT The invention relates to the production of a compression glass lead-through arrangement in a metal body. Compression glass lead-through arrangements of that kind are used in metal housings for semiconductors, in particular integrated circuits. These lead-through arrangements must hermetically seal off the interior of the housing relative to the outside world. For that purpose a glass bead is fused into a bore in the housing and the connecting conductor of the integrated circuit is passed outwardly through the glass. It has now been found that alloys of the systems Cu, Al and Mg, during the cooling operation after the fusing-in procedure exhibit a hardening effect which provides that, with those alloys, it is possible to produce compression glass lead-through arrangements which have hermetic sealing integrity even after a high degree of thermal and/or mechanical loading. They have a high resistance to fluctuations in temperature and good resistance to corrosion. (Figure 4).
Findl Walter
Hornig Wolfgang
Electrovac Gesellschaft Mbh
Fetherstonhaugh & Co.
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