Conductive metallization of substrates without developing...

Details Conductive metallization of substrates without developing... Conductive metallization of substrates without developing...

C - Chemistry, Metallurgy

23

C

117/104, 117/109

C23C 24/08 (2006.01) B05D 3/02 (2006.01) B05D 5/12 (2006.01) C23C 4/18 (2006.01) H01B 1/22 (2006.01) H05K 3/10 (2006.01) H05K 3/14 (2006.01) H05K 3/20 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1298740

Abstract of the Disclosure A conductive metal layer is formed on a substrate having a softening point above about 200°C by depositing copper or nickel particles on the substrate, and heating and pressing the metal particles. Unlike similar methods, no developing agent is required to render the metal layer conductive. The coated substrates are useful for a variety of uses such as EMI shielding and printed circuit boards.

570693

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