Conductive via fill inks for ceramic multilayer circuit...

Details Conductive via fill inks for ceramic multilayer circuit... Conductive via fill inks for ceramic multilayer circuit...

H - Electricity

05

K

H05K 1/03 (2006.01) C09D 11/00 (2006.01) H01L 23/498 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2211540

Conductive via fill inks for green tapes to be stacked and bonded to a support substrate, the glass used for the green tape having a firing temperature from 850-950 ° C, wherein the glass used for the via fill ink has a glass transition temperature that is higher than that of the glass used to make the green tape, preferably does not crystallize at the maximum firing temperature of the green tape and comprises from 30-75 percent by volume of the glass-conductive metal powder mixture of the via fill ink. These conductive via fill inks will not shrink until the green tape shrinkage has commenced during firing of the composite circuit board and they will flow slightly during firing, forming good bonds to the glass in the walls of the vias, thereby ensuring good integrity of the vias and good connections to the circuitry on the fired ceramic multilayer circuit board.

Encres conductrices de remplissage des trous d'interconnexion pour rubans crus empilés avant d'être fixés à un substrat support. La température de cuisson du verre constitutif du ruban cru est comprise entre 850 DEG C et 950 DEG C et celle du verre utilisé pour l'encre, plus élevée, ne doit de préférence pas lui permettre de cristalliser à la température maximale de cuisson du ruban cru. Le verre utilisé pour l'encre représente entre 30 et 75 % en volume du mélange pulvérulent verre/métal de l'encre de remplissage. L'encre ne subit pas de retrait avant que le retrait du ruban cru n'ait commencé au cours de la cuisson de la plaquette de circuit composite et elle s'écoule légèrement pendant la cuisson et adhère fortement au verre des parois des trous d'interconnexion qui présentent ainsi une fois cuits une bonne cohésion et de bonnes liaisons avec les conducteurs des plaquettes de circuits céramiques multicouches.

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