4. H - Electricity
  5. 05
  6. K

Barry Jay Thaler

H - Electricity – 05 – K

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Country: United States Of America

Conductive via fill inks for ceramic multilayer circuit...

H - Electricity – 05 – K
Patent

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Electrical feedthroughs for ceramic circuit board support...

H - Electricity – 05 – K
Patent

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Glass bonding layer for a ceramic circuit board support...

H - Electricity – 05 – K
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Low dielectric loss glasses

C - Chemistry – Metallurgy – 03 – C
Patent

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Method of fabricating multilayer circuit structures

H - Electricity – 05 – K
Patent

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Method of fabricating multilayer circuit structures

H - Electricity – 05 – K
Patent

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Profile ID: LFCA-PAI-P-1149531

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