Method of fabricating multilayer circuit structures

Details Method of fabricating multilayer circuit structures Method of fabricating multilayer circuit structures

H - Electricity

05

K

117/65

H05K 3/46 (2006.01) B05D 3/02 (2006.01) B05D 3/06 (2006.01) B05D 5/12 (2006.01) H01L 21/48 (2006.01) H05K 3/12 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1290201

METHOD OF FABRICATING MULTILAYER CIRCUIT STRUCTURES Abstract of the Disclosure An improved method of fabricating thick film dielectrics and copper conductors comprises depositing and drying an appropriate thick-film ink, treating the resulting patterned layer with a carbon dioxide plasma until substantially all of the organic vehicle is removed therefrom and then firing the layer in an inert atmosphere. In an alternate embodiment, a dried dielectric ink is initially treated with an oxygen plasma until about 75 to 99 percent of the vehicle is removed. Multilayer copper-based circuit structures fabricated utilizing the subject method are characterized by excellent integrity of the dielectric layers.

561726

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