H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/46 (2006.01) H01L 21/48 (2006.01) H01L 23/14 (2006.01) H01L 23/373 (2006.01) H05K 1/05 (2006.01) H05K 3/00 (2006.01)
Patent
CA 2211533
In the manufacture of ceramic circuit boards having ceramic or metal support substrates, a bonding glass layer that is adherent both to the substrate material and to multilayer green tape compositions having circuitry printed thereon, is deposited and flowed onto the support substrate. The bonding glasses suitable for use with nickel plated metal substrates and green tape compositions containing forsterite-cordierite-type glasses are mixed oxides including calcium, zinc and boron as well as other oxides. These bonding glasses have a thermal coefficient of expansion that is larger than the metal substrate, and a flow temperature below that of the cordierite-type glasses.
Dans la fabrication de plaquettes de circuits imprimés à substrat métallique ou céramique, on utilise une couche de verre de liaison adhérant à la fois au substrat et à une composition multicouche de ruban cru, sur laquelle sont imprimés les circuits, déposée par coulage sur le substrat de support. Les verres liants, compatibles avec les substrats métalliques à placage de nickel et les compositions de rubans crus contenant des verres de type forstérite-cordiérite, sont des mélanges d'oxydes de calcium, de zinc, de bore et autres. Ces verres liants possèdent un coefficient de dilatation plus élevé que celui du substrat métallique et une température de coulage inférieure à celle des verres de type cordiérite.
Prabhu Ashok Narayan
Thaler Barry Jay
David Sarnoff Research Center Inc.
Dimock Stratton Llp
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