H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/05 (2006.01) H01L 21/48 (2006.01) H01L 23/10 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 3/40 (2006.01) H05K 3/44 (2006.01) H05K 1/03 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2211542
Electrical feedthroughs in printed circuit board support substrates (24) for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide (22) and one or more layers of glass (26, 28), and then filling the remainder of the feedthroughs with a conductive metal via fill ink (30). After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate (24).
Traversées électriques pratiquées dans des substrats supports (24) de circuits imprimés en vue de la production de plaquettes de circuits imprimés céramiques double face multicouches. Pour réaliser lesdites traversées on isole les ouvertures des traversées au moyen d'une couche d'oxyde de nickel (22) et d'une ou plusieurs couches de verre (26, 28), puis on remplit le volume restant des ouvertures avec une encre (30) métallique conductrice de remplissage. Après cuisson, la structure résultante forme des traversées électriques traversant le substrat support (24).
Azzaro Thomas Peter
Conlon Edward James
Kumar Ananda Hosakere
Thaler Barry Jay
David Sarnoff Research Center Inc.
Dimock Stratton Llp
Lamina Lighting Inc.
LandOfFree
Electrical feedthroughs for ceramic circuit board support... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrical feedthroughs for ceramic circuit board support..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical feedthroughs for ceramic circuit board support... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2050452