Cool-applied hot melt adhesive composition

C - Chemistry – Metallurgy – 09 – J

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C09J 123/08 (2006.01) C09J 191/08 (2006.01) C09J 193/04 (2006.01)

Patent

CA 2166497

A carton, case or tray formed utilizing a hot melt adhesive composition said adhesive consisting essentially of a) 10 to 60% by weight of at least one ethylene n-butyl acrylate copolymer containing 25 to 45% by weight n-butyl acrylate and having a melt index of at least about 850; b) 20 to 60% of a rosin ester tackifying resin; c) 10 to 50% by weight of a microcrystalline or paraffin wax having a melting point of 65.5 to 93.2°C (150 to 200°F); d) 1 to 20% by weight of a polymeric additive selected from the group consisting of ethylene vinyl acetate containing 10 to 40 % by weight vinyl acetate, ethylene methyl acrylate polymers containing 10 to 28 % methyl acrylate, ethylene acrylic acid copolymers having an acid number of 25 to 150, polyethylene, polypropylene, poly-(butene-1-co-ethylene), and lower melt index ethylene n- butyl acrylate copolymers; and e) 0 to 1.5 % stabilizer, said adhesive characterized by a viscosity of less than 3000 cps at 135°C, fiber tearing bonds from within the range of -35 to 40°C.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Cool-applied hot melt adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cool-applied hot melt adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cool-applied hot melt adhesive composition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1794190

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.