Copper conductive composition capable of bonding to ceramic...

C - Chemistry – Metallurgy – 03 – C

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31/166, 6/225, 1

C03C 4/14 (2006.01) C03C 27/04 (2006.01) C04B 37/02 (2006.01) C04B 41/51 (2006.01) C04B 41/88 (2006.01) H01B 1/08 (2006.01) H01B 1/16 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1253660

PATENT Copper Conductive Composition Capable of Bonding To Ceramic And Glass Abstract A Conductive metal paste composition that includes Cu particles which exhibits excellent adhesion to ceramic, glass, or glass-ceramic surfaces. The improved adhesion is achieved by including in the paste Cu particles, an organic vehicle, and a eutectic composition of Cu20 and P205 which bonds to the Cu and the oxides of the ceramic and glass, when fired. The method of forming the metal paste composition includes the steps of forming a particulate material of a eutectic composition of Cu20 and P205, and combining the eutectic material with Cu particles and an organic vehicle. FI9-84-013

498315

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