C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 57/00 (2006.01) C08K 5/49 (2006.01) C09D 4/00 (2006.01) G11B 5/82 (2006.01) G11B 5/845 (2006.01) G11B 7/254 (2006.01) G11B 11/105 (2006.01)
Patent
CA 2065092
51 Abstract of the Disclosure A curable resin composition containing the followings as the essential component: (A) a compound having at least one curable acrylic radical, methacrylic radical or vinyl radial, or a mixture thereof; (B) an organic solvent containing an alcoholic organic solvent with an amount of not less than 40% by weight; (C) a compound having at least one pentavalent P with phosphoryl bonding; and (D) a polymerization initiator. When the composition is coated on the surface of molded inorganic or organic materials, the coating shows superiority in curing under atmosphere and the cured composition has excellent adhesion, surface hardness, resistance to scratch, resistance to abrasion, surface luster, transparency and antistatic property. Information recording media having surface coatings of the resin composition exhibit improved performance.
Hattori Yukari
Inagaki Hajime
Kurisu Masayoshi
Miyamoto Kazuyuki
Murakoshi Noriyuki
Kirby Eades Gale Baker
Mitsui Chemicals Incorporated
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