Curable epoxy resin mixture

C - Chemistry – Metallurgy – 08 – L

Patent

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400/4008, 400/50

C08L 63/00 (2006.01) C08G 59/32 (2006.01) C08G 59/50 (2006.01) C08L 9/00 (2006.01) C08L 35/00 (2006.01)

Patent

CA 1337088

Curable mixtures comprising (a) as epoxy resin component, 50 to 100 % by weight of a tetraglycidyl compound of formula I: Image ( I ), wherein R1, R2, R3 and R4 are each independently of the other a hydrogen atom, a halogen atom or C1-C4alkyl and X is a direct bond, methylene, isopropylidene, 0, C0, S or S02, and 0 to 50% by weight, based on the tetraglycidyl compound of formula I, of a diepoxy compound or of a polyepoxy compound differing from the compound of formula I, (b) as hardener, the diamine of formula II: Image ( II) in an amount such that there are 0.2 to 1.1 amine hydrogen equivalents per epoxy equivalent, in some cases a diamine of formula III: Image (III), wherein R5, R6, R7 and R3 are each independently of the other C1-C4alkyl, no more than two of the substituents R5 to R3 being ethyl, and R9, R10, R11 and R12 are each independently of the other a hydrogen or halogen atom, and in some cases a disecondary diamine of formula IV: Image ( IV), wherein Y is a polymethylene radical which is unsubstituted or substi- tuted by C1-C4alkyls and contains at least 4 C atoms in the linear polymethylene chain, and R13 and R14 are each a saturated carbocyclic ring which is unsubstituted or substituted by C1-C4alkyls, or a ring system containing at least 5 ring carbon atoms, the sum of the amine hydrogen equivalents of the diamines of formulae II, III and IV being not greater than 1.2, (c) 10 to 60 % by weight, based on epoxy resin component (a), of a thermoplastic with a glass transition temperature of at least 150°C, and (d) 0 to 20 % by weight, based on epoxy resin component (a), of an amine- or carboxyl-terminated rubber based on butadiene or butadiene-acrylo- nitrile, are suitable preferably for the manufacture of prepregs and thin films.

609004

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