Cure-box resin molded semiconductor device

Details Cure-box resin molded semiconductor device Cure-box resin molded semiconductor device

H - Electricity

01

L

356/173

H01L 21/50 (2006.01) H01L 21/48 (2006.01) H01L 23/10 (2006.01)

Patent

CA 1319763

72932-47 ABSTRACT In accordance with the present invention, semiconductor devices are produced by the process involving the steps of obtaining a core-box resin molded item integrated with a lead frame by coating the lead frame on its portions expected to be in non-contact with the core-box resin molded item with an organic high molecular substance having a melting or softening point higher than the molding temperature of the resin constituting the core-box resin molded item and soluble in a solvent which does not dissolve the core-box resin molded item, placing the thus coated lead frame in position within a mold and injecting the resin into the mold thereby carrying out injection or transfer molding and immersing the lead frame bearing core-box resin molded item obtained in the foregoing step in the solvent to remove by dissolving the organic high molecular substance. On that account, flashes of the resin formed on the lead frame can he removed easily or the formation of flashes can be suppressed without damaging the resin molded portion, whereby a good electrical connection between the lead frame and the semiconductor element can be accomplished.

608088

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