4. H - Electricity
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Kaoru Tominaga

H - Electricity – 01 – L

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Details

Inventor

Country: Japan

Cure-box resin molded semiconductor device

H - Electricity – 01 – L
Patent

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Polyimide resin compositions

C - Chemistry – Metallurgy – 08 – L
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Semiconductor device and method for manufacturing the same

H - Electricity – 01 – L
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Thermosetting resin composition

C - Chemistry – Metallurgy – 08 – G
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Profile ID: LFCA-PAI-P-1137925

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