Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

H - Electricity

01

L

H01L 23/055 (2006.01) H01L 23/00 (2006.01) H01L 23/057 (2006.01) H01L 23/495 (2006.01)

Patent

CA 2047486

This invention relates to a package construction of a semiconductor device and provides a hollow package for holding a semiconductor device in which a vapour-impermeable moistureproof plate is embedded in a bottom surface thereof or at a position inwardly of the bottom surface to provide increased moisture impermeability of the package.

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