Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

C - Chemistry, Metallurgy

08

G

402/257

C08G 73/12 (2006.01) C08G 59/40 (2006.01)

Patent

CA 1254343

ABSTRACT OF THE DISCLOSURE The present invention improves the handlability or operability of a polyamino bismaleimide resin composition by using a vinyl compound containing an epoxy group, and thus provides a non-solvent type polyaminobismaleimide resin composition. The combined use of the vinyl compound containing an epoxy group with an epoxy resin in the above resin combination reduces its shrinkage upon curing and gives a cured article having good dimensional stability or appearance characteristics.

494217

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