Polyimide resin compositions

Details Polyimide resin compositions Polyimide resin compositions

C - Chemistry, Metallurgy

08

L

400/5146, 400/53

C08L 79/08 (2006.01) C08G 73/12 (2006.01) C08G 77/455 (2006.01) C08K 13/02 (2006.01)

Patent

CA 1335616

A semiconductor encapsulating material is obtained from a polyimide resin composition comprising (A) a polyaminobismaleimide resin, (B) a silicone monomer and/or oligomer having a hydroxyl or alkoxyl group bonded to a silicon atom and mixtures thereof, and (C) an inorganic filler wherein the weight ratio of polyaminobismaleimide resin (A) to silicone component (B) ranges from 99.5/0.5 to 70/30, and the weight ratio of polyaminobismaleimide resin (A) to inorganic filler (C) ranges from 100/50 to 100/1000.

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