Cutting glass using subsurface fissures

Details Cutting glass using subsurface fissures Cutting glass using subsurface fissures

C - Chemistry, Metallurgy

03

B

164/19

C03B 33/00 (2006.01)

Patent

CA 1054923

ABSTRACT OF THE DISCLOSURE Pieces of flat glass are cut to desired size without the necessity of grinding to size and polishing. Edges of the piece are cut in accordance with a procedure involving the use of a large-diameter scoring wheel at a greater-than-usual applied pressure, to produce a subsurface discontinuity, e.g., a subsurface score or a subsurface crack, followed by the application of a bending moment about the subsurface discontinuity to propagate a fracture in the piece of glass. Trims may be removed from the piece in accordance with a procedure involving the creation of a subsurface discontinuity along an intended path of cut, followed by the application of surface heat along the discontinuity to increase tensile stresses within the piece along the intended path of cut. A bending moment is then applied about the intended path of cut to propagate a fracture in the piece of glass. Light seaming of the top and bottom portions of the edges completes the pre- paration of those edges.

292694

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