Cutting method using a laser having at least one...

B - Operations – Transporting – 23 – K

Patent

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B23K 26/38 (2006.01) B23K 26/06 (2006.01) B23K 26/14 (2006.01)

Patent

CA 2637535

The invention relates to method for cutting a part using a laser beam, involving the use of laser beam generation means comprising at least one ytterbium-based fibre having a wavelength of between 1 and 4 µm in order to generate the laser beam. The laser beam is selected to have a power of less than 100 kW, a power density of at least 1 MW/cm2, a focused beam diameter of at least 0.1 mm and a quality factor (BPP) of less than 10 mm.mrad.

L'invention porte sur un procédé de coupage par faisceau laser d'une pièce, dans lequel on utilise des moyens de génération de faisceau laser comprenant au moins une fibre à base d'ytterbium ayant une longueur d'onde entre 1 et 4 µm pour générer te faisceau laser. Ledit faisceau laser est sélectionné de manière à présenter une puissance inférieure à 100 kW, une densité de puissance d'au moins 1 MW/cm2, un diamètre de faisceau focalisé d'au moins 0,1 mm et un facteur de qualité (BPP) inférieur à 10 mm.mrad.

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