C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
C23F 1/02 (2006.01) B05D 1/32 (2006.01) B05D 5/12 (2006.01) B81B 3/00 (2006.01) B81C 1/00 (2006.01) C23C 16/24 (2006.01) C23C 16/511 (2006.01) H01M 8/00 (2006.01)
Patent
CA 2406214
This invention uses large surface to volume ratio materials for separation, release layer, and sacrificial material applications. The invention outlines the material concept, application designs, and fabrication methodologies. The invention is demonstrated using deposited column/void network materials as examples of large surface to volume ratio materials. In a number of the specific applications discussed, it is shown that it is advantageous to create structures on a laminate on a mother substrate and then, using the separation layer material approach, to separate this laminate from the mother substrate using the present separation scheme. It is also shown that the present materials have excellent release layer utility. In a number of applications it is also shown how the approach can be used to uniquely form cavities, channels, air-gaps, and related structures in or on various substrates. Further, it is demonstrated that it also can be possible and advantageous to combine the schemes for cavity formation with the scheme for laminate separation.
Selon l'invention, on utilise des matériaux à grand rapport surface-volume pour des applications de séparation, de couche de libération et de matériau sacrificiel. L'invention porte sur la notion de matériau, les conceptions d'application et les méthodologies de fabrication. On utilise des matériaux déposés en réseau de colonnes/vides en tant qu'exemples de matériaux à grand rapport surface-volume. Plusieurs applications spécifiques montrent l'intérêt de créer des structures sur un laminé posé sur un substrat-mère et, ensuite, suivant l'approche matériau d'application de séparation, de séparer ce laminé du substrat-mère selon ledit programme de séparation. Lesdits matériaux constituent en outre un excellent utilitaire de couche de libération. Plusieurs applications montrent également comment utiliser l'approche pour former uniquement des cavités, des canaux, des entrefers et des structures connexes à l'intérieur de divers substrats ou sur ces derniers. Enfin, il est également possible et intéressant de combiner les programmes relatifs à la formation de cavités à celui concernant la séparation de laminé.
Bae Sanghoon
Chang Kyuhwan
Fonash Stephen J.
Hayes Daniel J.
Kalkan Ali Kaan
Sim & Mcburney
The Penn State Research Foundation
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