H - Electricity – 01 – B
Patent
H - Electricity
01
B
H01B 1/22 (2006.01) C08K 3/08 (2006.01) C08K 7/06 (2006.01)
Patent
CA 2625013
The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate containing an organic binder component, a metal component with different metals and/or metal particle shapes, and a solvent component. The invention further relates to methods for producing said dispersion, methods for creating an optionally structured metal layer with the aid of the dispersion, the obtained substrate surfaces, and the use thereof.
La présente invention concerne une dispersion à appliquer sur une couche métallique sur un substrat non électroconducteur contenant une composante liant organique, une composante métallique avec différents métaux et/ou formes des particules métalliques ainsi qu'une composante solvant. L'invention concerne également un procédé de production de la dispersion, un procédé de production d'une couche métallique éventuellement structurée à l'aide de cette dispersion ainsi que les surfaces de substrat obtenues et leur utilisation.
Lippert Gerald
Lochtman Rene
Maas Heiko
Pfister Juergen
Schneider Norbert
Basf Se
Robic
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