Edtp-containing electroless copper baths

Details Edtp-containing electroless copper baths Edtp-containing electroless copper baths

C - Chemistry, Metallurgy

23

C

6/4, 117/80

C23C 18/38 (2006.01) C23C 18/40 (2006.01) C23C 18/54 (2006.01)

Patent

CA 1203051

OF: MILAN PAUNOVIC FRANCIS J. NUZZI FOR: IMPROVED EDTP-CONTAINING ELECTROLESS COPPER BATHS Abstract of Disclosure The improvement in electroless copper baths for the depo- sition of copper onto a substrate wherein ethylenedinitrilotetra-2- propanol (EDTP) is employed characterized by its ability to consis- tently provide in a test solution a copper plating bath rate of between 4.8 and 8.8 micrometers per hour at a temperature between 24 and 26°C and a copper deposit on a stainless steel strip which is smooth, non-flakey, unstressed and bright in color.

436539

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