H - Electricity – 01 – G
Patent
H - Electricity
01
G
H01G 2/04 (2006.01) H01G 9/08 (2006.01) H05K 7/20 (2006.01)
Patent
CA 2290794
The invention relates to an electronic component resembling a metal enclosure (1) with an integrated bottom (2), said enclosure being pressed against a thermal dissipation plate (13) by screw-type clamping means bearing upon the enclosure wall. The enclosure (1) presents in the area of attachment by said clamping means (3) a concave bump (10) to facilitate assembly, the centerline of said concave bump (10) being placed higher prior to securing the enclosure (1) by means of spikes in the clamping means (3), as compared with the bump position after the enclosure is secured.
Il s'agit d'un composant électrique se présentant comme un boîtier métallique (1) à fond (2) intégré, ledit boîtier (1) étant pressé contre une plaque de dissipation de chaleur (13) par des éléments de serrage vissables (3), en appui contre la paroi du boîtier. Lesdits éléments de serrage (3) présentent des pointes (6) sur la face frontale tournée vers la paroi du boîtier. Le boîtier (1) présente, dans la zone de fixation par les éléments de serrage (3), une bosse rentrante (10) qui facilite le montage, la ligne médiane de ladite bosse rentrante (10) étant placée plus haut avant la fixation du boîtier (1) par les pointes (6) des éléments de serrage (3), par rapport à après ladite fixation.
Hebel Rainer
Schweikert Wilhelm
Fetherstonhaugh & Co.
Siemens Matsushita Components Gmbh & Co. Kg
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