C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 5/18 (2006.01) H01L 23/535 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2314109
A layer of a metal is electroplated onto an electrically conducting substrate having a generally smooth surface with a small recess therein, having a transverse dimension not greater than about 350 micrometers, typically from about 5 micrometers to about 350 micrometers, by immersing the substrate and a counterelectrode in an electroplating bath of the metal to be electroplated and passing a modulated reversing electric current between the electrodes. The current contains pulses that are cathodic with respect to said substrate and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle less than about 50 % and said anodic pulses have a duty cycle greater than about 50 %, the charge transfer ratio of the cathodic pulses to the anodic pulses is greater than one, and the frequency of said pulses ranges from about 10 Hertz to about 12000 Hertz.
La présente invention concerne une couche de métal déposée sur un substrat électroconducteur qui présente une surface généralement lisse, avec un léger renfoncement, dont la dimension transversale ne dépasse pas 350 micromètres environ, et qui se situe généralement entre 5 et environ 350 micromètres. Le procédé consiste à immerger le substrat et une contre-électrode dans un bain de métal de placage et à faire passer un courant électrique à inversion de modulation entre les électrodes. Les impulsions de ce courant par rapport au substrat sont tantôt cathodiques, tantôt anodiques. Le cycle de conduction est inférieur à 50 % environ pour les impulsions cathodiques et supérieur à 50 % environ pour les impulsions anodiques, le rapport de transfert de charge étant supérieur à un, et la fréquence desdites impulsion étant comprise entre 10 et 12000 hertz environ.
Sun Jenny J.
Taylor E. Jennings
Zhou Chengdong
Faraday Technology Inc.
Gowling Lafleur Henderson Llp
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