Electromigration lifetime increase of lead base alloys

C - Chemistry – Metallurgy – 22 – C

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C22C 11/06 (2006.01) B23K 35/26 (2006.01) C22C 30/04 (2006.01)

Patent

CA 1257786

ELECTROMIGRATION LIFETIME INCREASE OF LEAD BASE ALLOYS ABSTRACT Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.

498313

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