C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
75/20
C22C 11/06 (2006.01) B23K 35/26 (2006.01) C22C 30/04 (2006.01)
Patent
CA 1257786
ELECTROMIGRATION LIFETIME INCREASE OF LEAD BASE ALLOYS ABSTRACT Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.
498313
Fouts David P.
Gupta Devandra
Ho Paul S.
Jaspal Jasvir S.
Lloyd James R. Jr.
Saunders Raymond H.
Wang Laboratories Inc.
LandOfFree
Electromigration lifetime increase of lead base alloys does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electromigration lifetime increase of lead base alloys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electromigration lifetime increase of lead base alloys will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1209925