Electronic circuit board and soldering method therefor

H - Electricity – 05 – K

Patent

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Details

H05K 1/02 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2300020

This invention discloses an electronic circuit board which can eliminate a soldering error for a component arranged such that its terminal array is perpendicular to the convey direction of the electronic circuit board which is to be flow-soldered, and a soldering method for it. An extending land (6) is formed to be substantially perpendicular to a convey direction (D) for flow soldering and to extend toward a downstream side of the warp of a board (2).

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