Electronic package with pliant heat sink

Details Electronic package with pliant heat sink Electronic package with pliant heat sink

H - Electricity

01

L

356/3

H01L 23/40 (2006.01) H01L 23/367 (2006.01)

Patent

CA 1290074

EN988027 ABSTRACT An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g, polyimide having chrome-copper-chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes pliant means (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.

600081

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