4. H - Electricity
  5. 05
  6. K

Joseph Funari

H - Electricity – 05 – K

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Details

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Electronic package with pliant heat sink

H - Electricity – 01 – L
Patent

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Epoxy removal

C - Chemistry – Metallurgy – 11 – D
Patent

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High memory density package

H - Electricity – 05 – K
Patent

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Micro-surface welding

H - Electricity – 05 – K
Patent

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Selective removal of excess solder

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Patent

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High memory density package

H - Electricity – 05 – K
Patent

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Profile ID: LFCA-PAI-P-504923

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